Low Temperature Plasmas: Fundamentals, Technologies and Techniques

With its strong focus on the links between theory and experiment or technological process, this book presents the latest advances in our understanding of how plasmas behave. New contributions to this second edition cover dusty plasmas, cross–correlation spectroscopy, and atmospheric pressure glow discharges, as well as applications in lighting, microelectronics, polymer surface modification, sterilization, biology and medicine.
Straddling the boundaries between physics, chemistry and materials science, this is of interest to a wide community.
From the Contents Volume 1:collision processesplasma–surface interactionsdusty plasmasplasma diagnosticssurface diagnosticsplasma sources
From the Contents Volume 2:atmosphereic pressure plasmasmicroplasmasplasma light sourcesplasma etchingplasma surface modificationplasma–based sterilizationmarkets for plasma technology
From reviews of the first edition:
"... it makes a highly valuable contribution to the subject area and will be accessible to scientists and engineers working in the field."
—ChemPhysChem

Spis treści:
Volume 1.
List of Contributors.
1 Characteristics of Low–Temperature Plasmas Under Nonthermal Conditions – A Short Summary (Alfred Rutscher † ).
1.1 Introduction.
1.2 Starting Point for Modeling the Plasma State.
1.3 The Role of Charge Carriers.
1.4 Facts and Formulas.
2 Electron Kinetics in Weakly Ionized Plasmas (Detlef Loffhagen, Florian Sigeneger, and Rolf Winkler).
2.1 Introduction.
2.2 Kinetic Treatment of the Electrons.
2.3 Kinetics in Time– and Space–Independent Plasmas.
2.4 Electron Kinetics in Time–Dependent Plasmas.
2.5 Electron Kinetics in Space–Dependent Plasmas.
2.6 Electron Kinetics in Time– and Space–Depen dent Plasmas.
2.7 Concluding Remarks.
2.7 References.
3 Elementary Collision Processes in Plasmas (Kurt Becker and Chun C. Lin).
3.1 Introduction.
3.2 Electron–Impact–Induced Collision Processes with Atoms.
3.2.1 Electron Excitation of Atoms: Overview.
3.3 Electron–Impact–Induced Collision Processes with Molecules.
3.4 Concluding Remarks.
3.4 References.
4 Elementary Processes of Plasma–Surface Interactions (Rainer Hippler).
4.1 Introduction.
4.2 Theoretical Considerations.
4.3 Scattering of Ions at Surfaces.
4.4 Physical Sputtering.
4.5 Electron Emission.
4.6 Chemical Effects.
5 Plasma–Surface Interaction (Holger Kersten and Achim von Keudell).
5.1 Introduction.
5.2 Elementary Mechanisms in Low–Temperature Plasma Processing.
5.3 Modeling of Etching and Deposition Processes.
5.4 Examples.
6 Fundamentals of Dusty Plasmas (André Melzer and John Goree).
6.1 Introduction.
6.2 Particle Charging.
6.3 Forces on Particles.
6.4 Experimental Methods.
6.5 Strongly Coupled Systems and Plasma Crystallization.
6.6 Waves in Dusty Plasmas.
6.7 Concluding Remarks.
6.7 References.
7 Langmuir Probe Diagnostics of Low–Temperature Plasmas (Sigismund Pfau and Milan Tichý).
7.1 Introduction.
7.2 The Langmuir Single–Probe Method.
7.3 General Theories of the Current to a Langmuir Probe.
7.4 The Druyvesteyn Method for Estimation of the Electron Energy Distribution Function (EEDF).
7.5 Probe Diagnostics of Anisotropic Plasmas.
7.6 Probe Diagnostics Under Noncollision–Free Conditions.
7.7 Langmuir Probe in a Magnetized Plasma.
7.8 Space and Time–Resolved Langmuir Probe Method.
7.9 Probe Diagnostic of Chemically Active Plasmas.
7.10 Double–Probe Technique.
7.10 References.
8 Emission and absorption spectroscopy (Jürgen Röpcke, Paul B. Davies, Frank Hempel, and Boris P. Lavrov).
8.1 Introduction.
8.2 Instrumental Techniques.
8.3 Emission Spectroscopy.
8.4 Absorption Spectroscopy.
8.5 Results and Applications: Physical Properties of Plasmas.
8.6 Conclusions.
8.6 References.
9 Mass Spectrometric Diagnostics (Martin Schmidt, Rüdiger Foest, and Ralf Basner).
9.1 Introduction.
9.2 Instrumentation.
9.3 Coupling of the Mass Spectrometer with the Plasma System.
9.4 Neutral Gas Mass Spectrometry.
9.5 Ion Mass Spectrometry.
9.6 Mass Spectrometry for the Determination of Elementary Data for Plasma Physics.
9.7 Conclusions.
9.7 References.
10 Cross–Correlation Emission Spectroscopy (Hans–Erich Wagner, Kirill Vadimovich Kozlov, and Ronny Brandenburg).
10.1 Introduction.
10.2 The Technique of Cross–Correlation Spectroscopy.
10.3 Investigation of Filamentary and Diffuse Barrier Discharges.
10.3.1 Discharge Operation.
10.4 Investigation of Corona Discharges.
10.5 Summary.
10.5 References.
11 Ellipsometric Analysis of Plasma–Treated Surfaces (Wolfgang Fukarek).
11.1 Introduction.
11.2 Comparison with Other Techniques.
11.3 Experimental Technique.
11.4 Examples.
11.5 Limitations and Remaining Issues.
11.5 References.
12 Characterization of Thin Solid Films (Harm Wulff and Hartmut Steffen).
12.1 Introduction.
12.2 X–Ray Methods for Thin Film Analysis.
12.3 X–Ray Photoelectron Spectroscopy (XPS).
12.4 Examples.
12.5 Characterization of Ag Clusters.
12.6 Conclusions.
12.6 References.
13 Plasma Sources (Martin Schmidt and Hans Conrads).
13.1 Introduction.
13.2 Properties of Nonthermal Plasmas.
13.3 Plasma Generation by Electric Fields.
13.4 Plasma Generation by Beams.
13.5 Conclusions.
13.5 References.
14 Reactive Nonthermal P lasmas (Hans–Erich Wagner).
14.1 Introduction.
14.2 Chemical Quasiequilibria.
14.3 Plasma Chemical Similarity.
14.4 The Method of Generalized Macroscopic kinetics.
14.5 Summary.
14.5 References.
Volume 2.
15 Atmospheric Pressure Glow Discharges (Alan Garscadden).
15.1 Introduction.
15.2 Characteristics of the Atmospheric Pressure Glow Discharge.
15.3 Near Cathode Phenomena at Atmospheric Pressure.
15.4 Boundary Controlled Discharges.
15.5 Glow–to–Arc Stabilization Approaches.
15.6 RF Excited Glow Discharges.
15.7 Microwave Excited Atmospheric Glow Discharges.
15.8 Atmospheric Discharges Using Gas–Liquid Interface.
15.9 Miniature Boundary Controlled Discharges.
15.10 Applications.
15.11 Summary and Recommendations for Future Research.
15.11 References.
16 High–Pressure Plasmas: Dielectric–Barrier and Corona Discharges (Ulrich Kogelschatz and Jürgen Salge).
16.1 Introduction.
16.2 Dielectric–Barrier Discharges.
16.3 Corona Discharges.
16.3 References.
17 High–Pressure Microdischarges (Kurt H. Becker and Karl H. Schoenbach).
17.1 Introduction.
17.2 History of Microdischarges.
17.3 Materials and Fabrication Techniques.
17.4 Diagnostics of Microplasma and Microplasma Properties.
17.5 Applications of Microdischarges.
17.6 Summary and Outlook.
17.6 References.
18 Materials Applications of High–Pressure Microplasmas (R. Mohan Sankaran and Konstantinos P. Giapis).
18.1 Introduction.
18.2 Microdischarge Setup.
18.3 Properties of Microplasma Sources.
18.4 Nonlithographic Etching of Silicon Substrates.
18.5 Thin Film Deposition.
18.6 Continuous Flow Microreactor Synthesis of Nanoparticles.
18.7 Particle Charging.
18.7 References.
19 Transient Plasma Ignition (Charles Cathey and Martin Gundersen).
19.1 I ntroduction.
19.2 Streamer Motivation.
19.3 Pulse Detonation Engine.
19.4 Internal Combustion Engine Applications.
19.5 Transient Plasma Ignition in High–Altitude, High–Speed Aircraft.
19.6 Summary.
19.6 References.
20 Transient Plasma–Assisted Diesel Exhaust Remediation (M. Gundersen, V. Puchkarev, A. Kharlov, G. Roth, J. Yampolsky, and D. Erwin).
20.1 Introduction.
20.2 Experiment.
20.3 Experimental Results.
20.4 Summary.
20.4 References.
21 Plasma Display Panel (Jae Koo Lee and John P. Verboncoeur).
21.1 Introduction and Overview.
21.2 History and Background.
21.3 Alternating Current Plasma Display Panel (AC–PDP).
21.4 Other PDP Types.
21.5 Conclusions.
21.5 References.
22 Low–Pressure Discharge Light Sources (Graeme Lister).
22.1 Introduction.
22.2 The Physics of Low–Pressure Discharge Lamps.
22.3 Conventional (Electroded) Fluorescent Lamps.
22.4 Electrodeless Fluorescent Lamps.
22.5 Low–Pressure Sodium Lamps.
22.6 Rare Gas Discharges for Lighting.
22.7 Alternatives to Mercury.
22.8 Conclusions.
22.8 References.
23 High–Pressure Plasma Light Sources (Klaus Günther).
23.1 Introduction and Basic Equations.
23.2 Application Demands.
23.3 High–Intensity Discharge (HID) Lamps and their Operational Principle.
23.4 Lamp Operation.
23.5 Conclusions.
23.5 References.
24 EUV Light Sources (Larissa Juschkin, Günther Derra, and Klaus Bergmann).
24.1 Introduction.
24.2 Plasmas as EUV Radiators.
24.3 Laser–Produced Plasmas for EUV Generation.
24.4 Discharge–Produced Plasmas for EUV Generation.
24.5 System Integration.
24.6 Outlook.
24.6 References.
25 Plasma Etching in Microelectronics (Harald H. Richter, Steffen Marschmeyer, and André Wolff).
25.1 Characterization of Plasma Et ching.
25.2 Etching Techniques.
25.3 Equipment–Related Topics.
25.4 Etch Chemistries.
25.5 Dry Etching in Advanced Technologies (Selected Examples).
25.6 Process Control.
25.7 Plasma–Process–Induced Damage.
25.8 Summary and Future Outlook.
25.8 References.
26 Magnetron Discharges for Thin Film Deposition (Klaus Ellmer).
26.1 Introduction.
26.2 Brief Historical Overview.
26.3 Charges in a Magnetic Field.
26.4 Principle of a Magnetron Discharge.
26.5 Types of Magnetron Discharges.
26.6 Discharge Characteristics.
26.7 Potential Distribution.
26.8 Excitation of Magnetron Sources.
26.9 Reactive Magnetron Sputtering.
26.10 Self–Sputtering of Metals.
26.11 Ionized Magnetron Sputtering.
26.12 Magnetron Sputtering of Thin Films.
26.13 Industrial Magnetron Sputtering Systems.
26.14 Advantages and Limitations of Magnetron Sputtering Sources.
26.14 References.
27 Hollow Cathodes and Plasma Jets for Thin Film Deposition (Zdenek Hubicka).
27.1 Introduction.
27.2 Direct Current (DC) Hollow Cathode Discharge.
27.3 Radiofrequency (RF) Hollow Cathode Discharge.
27.4 RF and DC Hollow Cathode Plasma Jet Systems for Low–Pressure PVD of Thin Films.
27.5 DC and RF Hollow Cathode Characterization During PVD of Thin Films.
27.6 Multiplasma Jet System for Coatings of Higher Surfaces and Deposition of Alloys.
27.7 Deposition of ferroelectric thin films by RF–modulated plasma jet systems.
27.8 Summary.
27.8 References.
28 Low–Temperature Plasmas for Polymer Surface Modification (Jürgen Meichsner).
28.1 Introduction.
28.2 Low–Temperature Plasma and Plasma–Polymer Interaction.
28.3 Plasma Modification of Polyethylene and Polystyrene.
28.4 Plasma Modification of Wool and Cellulose Fabrics.
28.5 Summary.
28.5 References.
29 Plasma–Enhanced Deposition of Supe rhard Thin Films (Achim Lunk).
29.1 Characterization of Superhard Materials.
29.2 Plasma–Enhanced Deposition of Diamond and Diamond–Like Carbon.
29.3 Plasma–Enhanced Deposition of Cubic Boron Nitride Films.
29.3 References.
30 Applications of Dusty Plasmas (Rainer Hippler and Holger Kersten).
30.1 Introduction.
30.2 Particle Synthesis in Acetylene Plasmas.
30.3 Coating of Powder Particles in a Combined Radiofrequency/Magnetron Discharge.
30.4 Deposition of Protective Coatings onto Phosphore Particles.
30.5 Formation and Deposition of Nanosize Clusters on Surfaces.
30.5 References.
31 Plasma–Assisted Surface Modification of Biointerfaces (Andreas Ohl and Karsten Schröder).
31.1 Introduction.
31.2 Plasma Surface Fuctionalization for Cell Adhesion Improvement.
31.3 Plasma–Induced Surface Grafting of Biomolecules.
31.4 Plasma–Assisted Chemical Vapour Deposition for Coating of Biomedical Devices.
31.5 Conclusions.
31.5 References.
32 Cold–Plasma–Based Sterilization (Mounir Laroussi).
32.1 Introduction.
32.2 Low–Pressure Studies.
32.3 Cold Plasma Sources Used in Plasma–Based Sterilization.
32.4 Kinetics of Inactivation and Inactivation Agents.
32.5 Inactivation of Biofilms.
32.6 Conclusions and Prospects.
32.6 References.
33 Atmospheric Plasma: A Universal Tool for Physicians? (Eva Stoffels).
33.1 Background.
33.2 How to Obtain? (Methods of Generation).
33.3 How to Apply? (Various Effects on Living Subjects).
33.4 Concluding Remarks.
33.4 References.
34 Markets for Plasma Technology (Klaus–Dieter Weltmann, Martin Schmidt, and Kurt Becker).
34.1 Introduction.
34.2 Market Situation in Selected Areas.
34.3 New Markets.
34.4 Conclusions.
34.4 References.
Index.

Nota biograficzna:
Rain er Hippler is full professor at the Institute of Physics, University of Greifswald. Together with the Max–Planck–Institute for Plasma Physics and the Institute of Low Temperature Plasma Physics in Greifswald the University represents an important center of competence for Plasma Physics and Plasma Technology. His main subjects are complex plasmas including thin film deposition, dusty plasmas, and deposition of nano–size particles on surfaces.
Holger Kersten teaches as professor at the Institute of Experimental and Applied Physics, University of Kiel. He is working in the field of plasma physics and plasma technology, with emphasis on complex (dusty) plasmas, plasma surface interaction, and ion beam diagnostics.
Martin Schmidt is a leading scientist at the Institute of Low Temperature Plasma Physics in Greifswald, a center of application–oriented research which belongs to the Leibniz–Science Community.
Karl H. Schoenbach holds the Batten Endowed Chair for Bioelectrics at Old Dominion University in Norfolk, Virginia, where he serves as Director of the Frank Reidy Research Center for Bioelectrics, a center devoted to research on biological effects of cold plasma and pulsed electric fields.

Okładka tylna:
With its strong focus on the links between theory and experiment or technological process, this book presents the latest advances in our understanding of how plasmas behave. New contributions to this second edition cover dusty plasmas, cross–correlation spectroscopy, and atmospheric pressure glow discharges, as well as applications in lighting, microelectronics, polymer surface modification, sterilization, biology and medicine.
Straddling the boundaries between physics, chemistry and materials science, this is of interest to a wide community.
From the Contents Volume 1:collision processesplasma–surface interactionsdusty plasmasplasma diagno