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Enabling Technology for MEMS and Nanodevices: Advanced Micro and Nanosystems - ISBN 9783527307463

Enabling Technology for MEMS and Nanodevices: Advanced Micro and Nanosystems

ISBN 9783527307463

Autor: Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata

Wydawca: Wiley

Dostępność: 3-6 tygodni

Cena: 1 524,60 zł

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ISBN13:      

9783527307463

ISBN10:      

352730746X

Autor:      

Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink, Osamu Tabata

Oprawa:      

Hardback

Rok Wydania:      

2004-07-09

Ilość stron:      

439

Wymiary:      

247x186

Tematy:      

PN

Advanced Micro & Nanosystems (AMN) provides cutting–edge reviews and detailed case studies by top authors from science and industry, covering technologies, devices and advanced systems from the micro and nano worlds, which together have an immense innovative application potential that opens up with control of shape and function from the atomic level right up to the visible world without any technological gaps.
In this volume, a close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefits of three–dimensional silicon processing. An insider′s view of industrial MEMS commercialization is followed by chapters on capacitive interfaces for MEMS, packaging issues of micro– and nanosystems, MEMS contributions to high frequency integrated resonators and filters, and the uses of MEMS in mass data storage and electrochemical imaging by means of scanning micro– and nanoprobes.
The second section on nanodevices first tackles the emerging topic of nanofluidics with a contribution each on simulation tools and on devices and uses, followed by another two on nanosensors featuring CNT sensors and CMOS–based DNA sensor arrays, respectively.

Spis treści:
Preface.
List of Contributors.
1. M3: the Third Dimension of Silicon (P.M. Sarro).
2. Trends in MEMS Commercialization (J.W. Knutti and H.V. Allen).
3. Capacitive Interfaces for MEMS (V.P. Petkov and B.E. Boser).
4. Packaging of Advanced Micro– and Nanosystems (V.M. Bright, C.R. Stoldt, D.J. Monk, M. Chapman, and A. Salian).
5. High–frequency Integrated Microelectromechanical Resonators and Filters (F. Ayazi).
6. MEMS in Mass Storage Systems (T.R. Albrecht, J.U. Bu, M. Despont, E. Eleftheriou, and T. Hirano).
7. Scanning Micro– and Nanoprobes for Electrochemical Imaging (C. Kranz, A. Kueng, and B. Mizaikoff).
8. Nanofluidic Modeling and Simul ation (M. Geier, A. Greiner, D. Kauzlaric, and J.G. Korvink).
9. Nanofluidics – Structures and Devices (J. Lichtenberg and H. Baltes).
10. Carbon Nanotubes and Sensors: a Review (J.R. Stetter and G.J. Maclay).
11. CMOS–based DNA Sensor Arrays (R. Thewes, F. Hofman, A. Frey, M. Schienle, C. Paulus, P. Schindler–Bauer, B. Holzapfl, and R. Brederlow).
Subject Index.

Okładka tylna:
Advanced Micro & Nanosystems (AMN) provides cutting–edge reviews and detailed case studies by top authors from science and industry, covering technologies, devices and advanced systems from the micro and nano worlds, which together have an immense innovative application potential that opens up with control of shape and function from the atomic level right up to the visible world without any technological gaps.
In this volume, a close look at enabling technologies is taken, the first section on MEMS featuring an introduction to the challenges and benefits of three–dimensional silicon processing. An insider′s view of industrial MEMS commercialization is followed by chapters on capacitive interfaces for MEMS, packaging issues of micro– and nanosystems, MEMS contributions to high frequency integrated resonators and filters, and the uses of MEMS in mass data storage and electrochemical imaging by means of scanning micro– and nanoprobes.
The second section on nanodevices first tackles the emerging topic of nanofluidics with a contribution each on simulation tools and on devices and uses, followed by another two on nanosensors featuring CNT sensors and CMOS–based DNA sensor arrays, respectively.

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