Autor: Edited by Mehul Naik , Roey Shaviv , Takashi Yoda , Kazuyoshi Ueno
Wydawca: Cambridge University Press
Dostępność: 3-6 tygodni
Cena: 438,90 zł
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ISBN13: |
9781605111254 |
ISBN10: |
1605111252 |
Autor: |
Edited by Mehul Naik , Roey Shaviv , Takashi Yoda , Kazuyoshi Ueno |
Oprawa: |
Hardback |
Rok Wydania: |
2009-01-01 |
Ilość stron: |
769 |
Wymiary: |
235 x 158 mm |
Tematy: |
Materials science |
The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique “one conference at two sites” that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on Leading-edge Silicon Technology through Innovation and Collaboration, is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
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