Electronics Reliability and Measurement Technology: Nondestructive Evaluation

This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.

Measurement Science and Manufacturing Science Research
Nondestructive SEM for Surface and Subsurface Wafer Imaging
Surface Inspection-Research and Development
Wafer Level Reliability for High-Performance VLSI Design
Wafer Level Reliability Testing: an Idea Whose Time Has Come
Micro-Focus X-Ray Imaging
Measurement of Opaque Film Thickness
Intelligent Laser Soldering Inspection and Process Control
Rupture Testing for the Quality Control of Electrodeposited Copper Interconnections in High-Speed, High-Density Circuits
Heterodyne Holographic Interferometry: High-Resolution Ranging and Displacement Measurement
""Whole Wafer"" Scanning Electron Microscopy