Semiconductor Micromachining: Fundamental Electrochemistry and Physics

Semiconductor Micromachining – Fundamentals and Technology – is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III–V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 2: Techniques and Industrial Applications

Spis treści:
Electrochemical and Photochemical Properties of Semiconductors (S. Morrison).
Chemical and Electrochemical Etching of Semiconductors (J. Kelly & D. Vanmaekelbergh).
Photoetching of III–V Semiconductors: Basic Photoelectrochemical Principles (W. Plieth & S. Wetzenstein).
Influence of Photoelectrochemical Etching on Electronic Properties of Semiconductor Surfaces (R. Tenne).
Surface Conditioning of Silicon by Photoelectrochemical Etching (C. Levy–Clement).
Electrochemical Conditioning of Silicon: Surface Analyses and Electronic Implications (H. Lewerenz & H. Jungblut).
The Formation of Porous Silicon (D. Riley).
Index.

Okładka tylna:
Semiconductor Micromachining – Fundamentals and Technology – is a two volume work in which, for the first time, the various disciplines associated with the theory and practice of device fabrication are brought together in one comprehensive reference source. Volume 1 contains a detailed coverage of semiconductor electrochemistry and physics whilst Volume 2 describes the wide range of microengineering technologies with details of practical applications. The authors for each chapter have been carefully selected for their expertise and are acknowledged leaders in their respective fields. The purpose of this book is to enable workers in the area of semiconductor micromachining to have ready access to the basic literature, essential to provide a solid basis for the many different aspects of physics, chemistry, electronics and engineering involved with this technology. The main focus of the book is on structures based on silicon, the most common and versatile of the current range of commercially available semiconductors, but other materials such as III–V semiconductors are also considered. Together these two volumes provide an indispensable reference text for this fast growing area of applied science. It will be of value to a wide range of academic and industrial scientists, technologists and engineers who wish to expand their knowledge in this area of science and for whom thus far, there has been no convenient reference work. Volume 2: Techniques and Industrial Applications