Principles of Plasma Discharges and Materials Processing

A Thorough Update of the Industry Classic on Principles of Plasma Processing
The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals.
The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in–depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters.
New and expanded topics include:Updated cross sectionsDiffusion and diffusion solutionsGeneralized Bohm criteriaExpanded treatment of dc sheathsLangmuir probes in time–varying fieldsElectronegative dischargesPulsed power dischargesDual frequency dischargesHigh–density rf sheaths and ion energy distributionsHysteresis and instabilitiesHelicon dischargesHollow cathode dischargesIonized physical vapor depositionDifferential substrate charging
With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.

Spis treści:
1. Introduction.
2. Basic Plasma Equations and Equilibrium.
3. Atomic Collisions.
4. Plasma Dynamics.
5. Diffusion and Transport.
6. DC Sheaths.
7. Chemical Reactions and Equilibrium.
8. Molecular Collisions.
9. Chemical Kinetics and Surface Processes.
10. Particle and Energy Balance in Discharges.
11. Capacitive Discharges.
12. Inductive Discharges.
13. Wave& #8211;Heated Discharges.
14. DC Discharges.
15. Etching.
16. Deposition and Implantation.
17. Dusty Plasmas.
18. Kinetic Theory of Discharges.
Appendix A: Collision Dynamics.
Appendix B: The Collision Integral.
Appendix C: Diffusion Solutions for Variable Mobility Model.

Nota biograficzna:
MICHAEL A. LIEBERMAN, PhD, is Professor in the Graduate School in Electrical Engineering at the University of California, Berkeley. He has published more than 170 journal articles on the topics of plasmas, plasma processing, and nonlinear dynamics. He has also coauthored, with Professor Lichtenberg, Regular and Stochastic Motion and Regular and Chaotic Dynamics, Second Edition.
ALLAN J. LICHTENBERG, PhD, is Professor in the Graduate School in Electrical Engineering at the University of California, Berkeley. A respected pioneer in the fields of high–temperature plasmas, plasma discharges, and nonlinear dynamics, he has published about 150 articles in these areas. In addition to the books coauthored with Professor Lieberman, he has written an earlier monograph Phase–Space Dynamics of Particles (Wiley).

Okładka tylna:
A Thorough Update of the Industry Classic on Principles of Plasma Processing
The first edition of Principles of Plasma Discharges and Materials Processing, published over a decade ago, was lauded for its complete treatment of both basic plasma physics and industrial plasma processing, quickly becoming the primary reference for students and professionals.
The Second Edition has been carefully updated and revised to reflect recent developments in the field and to further clarify the presentation of basic principles. Along with in–depth coverage of the fundamentals of plasma physics and chemistry, the authors apply basic theory to plasma discharges, including calculations of plasma parameters and the scaling of plasma parameters with control parameters.
New and expanded topics i nclude:Updated cross sectionsDiffusion and diffusion solutionsGeneralized Bohm criteriaExpanded treatment of dc sheathsLangmuir probes in time–varying fieldsElectronegative dischargesPulsed power dischargesDual frequency dischargesHigh–density rf sheaths and ion energy distributionsHysteresis and instabilitiesHelicon dischargesHollow cathode dischargesIonized physical vapor depositionDifferential substrate charging
With new chapters on dusty plasmas and the kinetic theory of discharges, graduate students and researchers in the field of plasma processing should find this new edition more valuable than ever.