ULSI Semiconductor Technology Atlas

More than 1,100 TEM images illustrate the science of ULSI
The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems.
The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts:Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation Part II focuses on key ULSI modules—ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high–resolution TEM in microelectronics
This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with:More than 1,100 TEM images to illustrate the science of ULSIA historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issuesDiscussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD–ROMs

Spis treści:
FOREWORD.
PREFACE.
PART I.
1. Microelectronics and Microscopy.
2. ULSI Process Technology.
3. Applications of TEM for Constructi on Analysis.
4. TEM Sample Preparation Techniques.
PART II.
5. Ion Implantation and Substrate Defects.
6. Dielectrics and Isolation.
7. Silicides, Polycide, and Salicide.
8. Metallization and Interconnects.
PART III.
9. ULSI Devices I: DRAM Cell with Planar Capacitor.
10. ULSI Devices II: DRAM Cell with Stacked Capacitor.
11. ULSI Devices III: DRAM Cell with Trench Capacitor.
12. ULSI Devices IV: SRAM.
PART IV.
13. TEM in Failure Analysis.
14. Novel Devices and Materials.
15. TEM in Under Bump Metallization (UBM) and Advanced Electronics Packaging Technologies.
16. High–Resolution TEM in Microelectronics.
INDEX.

Nota biograficzna:
CHIH–HANG TUNG is a senior member of the technical staff and Project Leader at the Institute of Microelectronics in Singapore.
GEORGE T. T. SHENG was the first to develop cross–sectioning samples of TEM studies of semiconductor devices and has been involved with many other groundbreaking projects at Bell Labs.
CHIH–YUAN LU is Chairman and CEO of Ardentec Corp., an ULSI testing service company. He is also CTO of Macronix International Co., Ltd., the eighth largest worldwide NVM semiconductor company.

Okładka tylna:
More than 1,100 TEM images illustrate the science of ULSI
The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems.
The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts:Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation Part II focuses on key ULSI modules—ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high–resolution TEM in microelectronics
This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with:More than 1,100 TEM images to illustrate the science of ULSIA historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issuesDiscussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD–ROMs