Preventing Thermal Cycling and Vibration Failures in Electronic Equipment

This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.

Spis treści:
Preface.
Symbols.
Physics of Failure In Electronic Systems.
Thermal Expansion Displacements, Forces, and Stresses.
Vibration of Beams and Other Simple Structures.
Vibration of Printed Circuit Boards and Flat Plates.
Estimating Fatigue Life in Thermal Cycling and Vibration Environments.
Octave Rule, Snubbers, Dampers, and Isolation for Preventing Vibration Damage to Electronic Systems.
Displacements, Forces, and Stresses in Axial Leaded Component Wires Due to Thermal Expansions.
Designing Electronic Equipment for Sinusoidal Vibration.
Assessment of Random Vibration on Electronic Design.
Combining Fatigue Damage for Random Vibration and Thermal Cycling.
Thermal Cycling Failures in Surface–Mounted Components.
Stresses and Fatigue Life in Component Lead Wires and Solder Joints Due to Dynamic Forces and PCB Displacements.
Fatigue Life of Long Components, Tall Components, and Small Components Mounted on PCBs.
Wear and Interface Surface Fretting Corrosion in Electrical Connectors.
Case Histories of Failures and Failure Analyses.
Bibliography.
Index.