Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures.

The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students.

Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structuresReviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvementsGeared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors

Part I 1. Properties of silicon; Fracture toughness 2. Czochralski Growth of Silicon Crystals 3. Properties of Silicon Crystals 4. Silicon Wafers: Preparation and Properties; Modern technologies 5. Epi Wafers: Preparation and Properties 6. Thin Films on Silicon 7. Thick-Film SOI Wafers: Preparation and properties

Part II 8. Multiscale Modeling Methods 9. Mechanical Properties of Silicon Microstructures 10. Electrostatic and RF-Properties of MEMS Structures 11. Optical Modeling of MEMS 12. Modeling of Silicon Etching 13. Gas Damping in Vibrating MEMS Structures 14. Recent Progress in Large-scale Electronic State Calculations and Data-driven Sciences

Part III 15. MEMS Lithography 16. Deep Reactive Ion Etching; update 17. Wet Etching of Silicon 18. Porous Silicon Based MEMS 19. Surface Micromachining 20. Vapor Phase Etch Processes for Silicon MEMS 21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS 22. Microfluidics and BioMEMS in Silicon

Part IV 23. Silicon Direct Bonding 24. Anodic Bonding 25. Glass Frit Bonding 26. Metallic Alloy Seal Bonding 27. Emerging Wafer Bonding Technologies 28. Bonding of CMOS Processed Wafers 29. Wafer-Bonding Equipment 30. Encapsulation by Film Deposition 31. Dicing of MEMS Devices 32. 3D Integration of MEMS 33. Own chapter for eWLP 34. Through-Substrate Via Technologies for MEMS 35. Outgassing and Gettering

Part V 36. Silicon Wafer and Thin Film Measurements 37. Oxygen and Bulk Microdefects in Silicon 38. Optical Measurement of Static and Dynamic Displacement in MEMS 39. MEMS Residual Stress Characterization: Methodology and Perspective 40. Microscale deformation analysis 41. Strength of Bonded Interfaces 42. Hermeticity Tests 43. MEMS testing and calibration 44. MEMS Reliability

Part VI 45. Case Accelerometer 46. Case Gyroscope 47. Case Pressure Sensor 48. Case Microphone 49. Case Micromirror 50. Case Optical MEMs