High-Density Integrated Electrocortical Neural Interfaces: Low-Noise Low-Power System-on-Chip Design Methodology

High-Density Integrated Electrocortical Neural Interfaces provides a basic understanding, design strategies and implementation applications for electrocortical neural interfaces with a focus on integrated circuit design technologies. A wide variety of topics associated with the design and application of electrocortical neural implants are covered in this book. Written by leading experts in the field— Dr. Sohmyung Ha, Dr. Chul Kim, Dr. Patrick P. Mercier and Dr. Gert Cauwenberghs —the book discusses basic principles and practical design strategies of electrocorticography, electrode interfaces, signal acquisition, power delivery, data communication, and stimulation. In addition, an overview and critical review of the state-of-the-art research is included.

These methodologies present a path towards the development of minimally invasive brain-computer interfaces capable of resolving microscale neural activity with wide-ranging coverage across the cortical surface.

Written by leading researchers in electrocorticography in brain-computer interfacesOffers a unique focus on neural interface circuit design, from electrode to interface, circuit, powering, communication and encapsulationCovers the newest ECoG interface systems and electrode interfaces for ECoG and biopotential sensing

1. Introduction to ECoG and ECoG Interfaces
2. Electrode-to-Brain Interfaces
3. Integrated Circuit Interfaces for Data Acquisition
4. Integrated Circuit Interfaces for Stimulation
5. Power Management for mm-sized ECoG Implants
6. RF Power Transfer and its Considerations
7. Wireless Data Communication
8. Fully Integrated Modular ECoG Recording and Stimulation