Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.

Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder jointsNew updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connectionsNew chapter on testing procedures, sample handling and sample selection, and experimental designCoverage of new packaging materials, including plastics and composites

1. An Overview of Electronic Devices and Their Reliability
2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated
3. Defects, Contamination and Yield
4. The Mathematics of Failure and Reliability
5. Mass Transport-Induced Failure
6. Electronic Charge-Induced Damage
7. Environmental Damage to Electronic Products
8. Packaging Materials, Processes, and Stresses
9. Degradation of Contacts and Packages
10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices
11. Characterization and Failure Analysis of Material, Devices and Packages
12. Future Directions and Reliability Issues