Handbook of Materials Failure Analysis: With Case Studies from the Electronic and Textile Industries

Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance, and then logically proceeds from a discussion of the failure analysis process, types of failure analysis, specific tools and techniques, and analysis of materials failure from various causes. The book covers the most common types of materials failure analysis and possible solutions.

Failure can occur for several reasons: materials defects-related failure; materials design-related failure; or corrosion-related failures. The suitability of the materials to work in a definite environment is an important issue.

Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction Presents compelling new case studies from key industries to demonstrate concepts

Part 1: Electronics Industries 1. Failures of Electronic Devices: Solder Joints Failure Modes, Causes and Detection Method 2. Electron-beam Radiation Damage and the Technical Solutions for Materials Failure Analysis of Electron-beam Sensitive Materials in Modern Semiconductor Industry 3. Failure of intermetallic solder ball due to stress shielding and amplification effects 4. Assessment of the indoor corrosion in consumer electronics in subtropical climates. 5. Pb-free Solder – Microstructural, Material Reliability and Failure Relationships 6. The Role of Contamination in Failures of Electronics – Case Studies 7. Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology 8. Stress Analysis of Stretchable Conductive Polymer for Electronics Circuit Application 9. New methodology for qualification and lifetime assessment of electronic systems

Part 2: Textiles Industries 10. Textile Failure Analysis and Mechanical Behavior Characterization by using Acoustic Emission Technique 11. Failure of yarns in different textile applications 12. Treatment effect on failure mode of industrial carbon textile at elevated temperature